3M 7414 is designed for masking or protecting surfaces exposed to high temperatures where easy, residue-free removals are required. In particular, this tape is designed for the reflow soldering process.
3M high temperature & residue-less adhesive technologies and anti-static technology can provide value to customers by enabling product protection and process efficiency.
Our heat resistive polyimide tape series can be used in different applications such as Leadframe masking, PCB masking, sensor package protection, carrier for sputtering, and another high-temperature process, advanced substrate masking.
|Adhesion to Copper||D-3330, 90° Peel||7.7 oz/in width (8.4 N/100 mm)|
|Backing Thickness||D-3652||1.0 mil (0.025 mm)|
|Total Tape Thickness||D-3652||1.8 mil (0.046 mm)|
|Temperature Use Range||2 min at 260°C|
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