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SEKISUI 5782 is a 1.5 mil clear double-coated adhesive tape designed for continued adhesion in high-temperature environments up to 500°F/260°C.


SEKISUI 5782 Features

  • High-temperature adhesive and release liner survives short-term exposure to 500°F/260°C for lead-free solder reflowMaintains.
  • High adhesion strength in high temperatures.
  • Excellent for heat-intensive processing and ideal for flexible printed circuit (FPC) attachments and HSE metals.
  • High adhesion, excellent holding power, and low outgassing.

SEKISUI 5782 Applications

  • Printed circuit boards
  • Flexible circuits
  • Automotive underhood
  • Heat sink bonding

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