Adhesive Tape Materials And Whole Set Solutions
PE Foam Tape

3M 5419

3M 5419 is a translucent, polyimide film-backed silicone adhesive tape with unique and extremely low electrostatic discharge properties.

  • Brand: 3M
  • Model No.: 5419
  • Thickness:2.7mil/0.07mm
  • Color: Amber
  • Adhesive: Acrylic
  • Length: 33m
  • Temperature range: 180 ℃
  • Cutting: Any width
  • Die-cutting: Any shape and any size

3M 5419 Technical Data Sheet (TDS)

Property ValueMethod
Adhesion to Steel:20 oz./in. width (22 N/100 mm)D-3330
Tensile Strength at Break:33 lbs./in. width (578 N/100 mm) DD-3759
Elongation at Break:60%D-3759
Backing Thickness:1.0 mil (0.03 mm)D-3652
Total Tape Thickness:2.7 mil (0.07 mm)D-3652
Temperature Use Range:-73° to 260°C (-100° to 500°F)
Dielectric Strength:7000 voltsD-149
Insulating Resistance:>1*106 ohms
Static Charge: (measured at 50% RH,
70°F(21°C ) in an ESD controlled
Removal from roll: <150 volts
Removal from PWB: <50 volts
Outgassing:%TLM = 0.58, %CVCM = 0.24E-595
Flame Retardancy:PassPer UL-510
Product category: OARC2
File E230409

3M 5419 Features

  • Employs a proprietary technology that results in extremely low electrostatic discharge at unwinding and removal from the PWB. Conventional polyimide tapes can typically generate over 10,000 volts during use which can damage board-mounted electronic components. 3M Low Static Polyimide Film tape 5419 overcomes this problem without any of the typical drawbacks of conventional “anti-static” or “static-free” tapes (e.g. variable adhesion and opaqueness).
  • RoHS compliant.
  • At room temperature the properties of polyimide and polyester film are similar. However, as the temperature increases or decreases, the properties of the polyimide film are less affected than polyester.
  • Polyimide film does not soften at elevated temperatures, thus, the film provides an excellent release surface at elevated temperatures
  • Gold tab protection during wave solder of printed circuit boards.

3M 5419 Application

  • Mask for printed circuit boards during wave solder or solder dip process
  • Used as release surface in the fabrication of parts cured at elevated temperatures

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