Thermal Tape

Double-sided thermal tape is made of transfer thermal conduct glue or glass fiber coated with thermal conduct glue.

Usage: LED panel light, LED light bar components, and metal frame assembly.

Data Sheet

Structure

Features

Applications

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Thermal Tape Data Sheet

Thermal Conduct Tape No.	S11-05	S11-10	S11-15	S11-20	S11-25	S11-30
Total Thickness (mm)	0.05	0.1	0.15	0.2	0.25	0.3
180° Peel Adhesion (PSTC-101) (N/25mm)	8	10	13	13	15	15
Holding Power (1kg/inch/25℃)	>48
Thermal Conductivity （ASTM D22470）（W/m-k）	1.2
Color	White
Halogen-free	Passed
Resist Temperature	—20℃~120℃
Solvent resistance	Good

High Mechanical Strength.
Improved surface wet-out for rough surface/LSE substrates.
Excellent shock performance.
Customized the sizes and lengths.
Halogen-free.
Ideal for thin bonding applications.
High tacky thermal conductive PSA.
The performance of thermal conductivity, insulation, buffer, and high tackiness make it the best choice for an electronic application.
Flexible and conformable. Ideal for uneven surfaces.
Stable and economical with different thicknesses and constructions.
Good thermal transfer.
High bonding.
Strong adhesion, replacing screw fixation.
Perfect thickness standard.
Excellent thermal conductivity and insulation
A complete thickness standard is available.
Various structures are for different applications.
Stable and economic.
The superior adhesion strength and thermal conductive efficiency.
Easy for die-cutting.
High tensile strength, easy to use.

IC Packaging Heat Conduction‎.
IC heat sink use.
Between heat sink and package chip.
Circuit board heat dissipation and protection.
Fixing the heat sink on the power supply circuit board.
Fixing heat sink on vehicle control circuit board.
Replacing screws, fasteners, and other fixed means.
Power circuit board.
Vehicle control circuit board.
Heatsink-Thermal Interface Attachment‎.
Heatsink-Thermal Interface-Non Bonding.
Battery Thermal Management‎.
LED Lighting Thermal Management‎.
LED light bar heat dissipation, prolongs life.
LED light bar and metal frame.
For CPU, LED, PPR heat sink, micro process.
Mainly used in electronic appliances, LED lighting, the hardware industry, the printing industry, and other manufacturing industries.
Flex Bonding.
Thermal Interface-Damping-Cushioning.
Electronic transistor use.
It can replace hot melt adhesive, screw, fastener, and other fixing methods.
Assembly of the heat sink and DDR-RAM module.
Assembly of the LED light bar module and metal frame bezel.
Die-cut piece and Laminate.
Applied to the chip, flexible circuit boards, high-power transistors, heat sinks, or other cooling device bonding.