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Thermal Tape

  • Thermal Tape
  • Thermal Tape
  • Thermal Tape
  • Thermal Tape
  • Thermal Tape

Thermal tape is made of transfer thermal conduct glue or glass fiber coated with thermal conduct glue.

  • Color: White
  • Thickness(mm): 0.05 | 0.1 | 0.15 | 0.2 | 0.25 | 0.3
  • Width: Customized
  • Die-cutting: Any shape
  • Samples: Free

Usage: LED panel light, LED light bar components, and metal frame assembly.

Data Sheet
Structure
Features
Applications
Download
Thickness

Thermal Tape Data Sheet

Thermal Conduct Tape No.S11-05S11-10S11-15S11-20S11-25S11-30
Total Thickness (mm)0.050.10.150.20.250.3
180° Peel Adhesion (PSTC-101)
(N/25mm)
81013131515
Holding Power (1kg/inch/25℃) >48
Thermal Conductivity
(ASTM D22470)(W/m-k)
1.2
ColorWhite
Halogen-freePassed
Resist Temperature —20℃~120℃
Solvent resistanceGood

Thermal Tape Structure

Thermal Tape Structure
  • White or Blue Liner
  • Thermal Conduct Glue 
  • Fiber Glass
  • Thermal Conduct Glue

Thermal Tape Features

  • High Mechanical Strength.
  • Improved surface wet-out for rough surface/LSE substrates.
  • Excellent shock performance.
  • Customized the sizes and lengths.
  • Halogen-free.
  • Ideal for thin bonding applications.
  • High tacky thermal conductive PSA.
  • The performance of thermal conductivity, insulation, buffer, and high tackiness make it the best choice for an electronic application.
  • Flexible and conformable. Ideal for uneven surfaces.
  • Stable and economical with different thicknesses and constructions.
  • Good thermal transfer.
  • High bonding.
  • Strong adhesion, replacing screw fixation.
  • Perfect thickness standard.
  • Excellent thermal conductivity and insulation
  • A complete thickness standard is available.
  • Various structures are for different applications.
  • Stable and economic.
  • The superior adhesion strength and thermal conductive efficiency.
  • Easy for die-cutting.
  • High tensile strength, easy to use.

Thermal Tape Applications

  • IC Packaging Heat Conduction‎.
  • IC heat sink use.
  • Between heat sink and package chip.
  • Circuit board heat dissipation and protection.
  • Fixing the heat sink on the power supply circuit board.
  • Fixing heat sink on vehicle control circuit board.
  • Replacing screws, fasteners, and other fixed means.
  • Power circuit board.
  • Vehicle control circuit board.
  • Heatsink-Thermal Interface Attachment‎.
  • Heatsink-Thermal Interface-Non Bonding.
  • Battery Thermal Management‎.
  • LED Lighting Thermal Management‎.
  • LED light bar heat dissipation, prolongs life.
  • LED light bar and metal frame.
  • For CPU, LED, PPR heat sink, micro process.
  • Mainly used in electronic appliances, LED lighting, the hardware industry, the printing industry, and other manufacturing industries.
  • Flex Bonding.
  • Thermal Interface-Damping-Cushioning.
  • Electronic transistor use.
  • It can replace hot melt adhesive, screw, fastener, and other fixing methods.
  • Assembly of the heat sink and DDR-RAM module.
  • Assembly of the LED light bar module and metal frame bezel.
  • Die-cut piece and Laminate.
  • Applied to the chip, flexible circuit boards, high-power transistors, heat sinks, or other cooling device bonding.
Thermal-Conduct-Tape-Application
ItemTotal Thickness(mm)Adhesion(N/25mm)
S11-050.058
S11-100.110
S11-150.1513
S11-200.213
S11-250.2515
S11-300.315

Note: All the above data are just for reference, all data might change without notices or updates, please contact our sales team to confirm all details Via Whatsapp or Email.

Contact Adhtapes To Get The Quote Or Sample

Sales - Mr Jason
Sales - Mrs Lulu
Sales - Mr Tom
Sales - Mrs Sasa

    +86-755-2301-3143
    +86-158-7555-3143
    NO.57 Houting Second Industry Area Shajing Baoan Shenzhen China 518104

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