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Adhesive Tape Materials And Whole Set Solutions

Thermal Tape

Thermal Tape

Double-sided thermal tape is made of transfer thermal conduct glue or glass fiber coated with thermal conduct glue.

  • Color: White
  • Thickness(mm): 0.05 | 0.1 | 0.15 | 0.2 | 0.25 | 0.3
  • Width: Customized
  • Die-cutting: Any shape
  • Samples: Free

Usage: LED panel light, LED light bar components, and metal frame assembly.

Data Sheet
Structure
Features
Applications
Download

Thermal Tape Data Sheet

Thermal Conduct Tape No.S11-05S11-10S11-15S11-20S11-25S11-30
Total Thickness (mm)0.050.10.150.20.250.3
180° Peel Adhesion (PSTC-101)
(N/25mm)
81013131515
Holding Power (1kg/inch/25℃) >48
Thermal Conductivity
(ASTM D22470)(W/m-k)
1.2
ColorWhite
Halogen-freePassed
Resist Temperature —20℃~120℃
Solvent resistanceGood

Thermal Tape Structure

Thermal-conduct-tape-structure

Thermal Tape Features

  • High Mechanical Strength.
  • Improved surface wet-out for rough surface/LSE substrates.
  • Excellent shock performance.
  • Customized the sizes and lengths.
  • Halogen-free.
  • Ideal for thin bonding applications.
  • High tacky thermal conductive PSA.
  • The performance of thermal conductivity, insulation, buffer, and high tackiness make it the best choice for an electronic application.
  • Flexible and conformable. Ideal for uneven surfaces.
  • Stable and economical with different thicknesses and constructions.
  • Good thermal transfer.
  • High bonding.
  • Strong adhesion, replacing screw fixation.
  • Perfect thickness standard.
  • Excellent thermal conductivity and insulation
  • A complete thickness standard is available.
  • Various structures are for different applications.
  • Stable and economic.
  • The superior adhesion strength and thermal conductive efficiency.
  • Easy for die-cutting.
  • High tensile strength, easy to use.

Thermal Tape Applications

  • IC Packaging Heat Conduction‎.
  • IC heat sink use.
  • Between heat sink and package chip.
  • Circuit board heat dissipation and protection.
  • Fixing the heat sink on the power supply circuit board.
  • Fixing heat sink on vehicle control circuit board.
  • Replacing screws, fasteners, and other fixed means.
  • Power circuit board.
  • Vehicle control circuit board.
  • Heatsink-Thermal Interface Attachment‎.
  • Heatsink-Thermal Interface-Non Bonding.
  • Battery Thermal Management‎.
  • LED Lighting Thermal Management‎.
  • LED light bar heat dissipation, prolongs life.
  • LED light bar and metal frame.
  • For CPU, LED, PPR heat sink, micro process.
  • Mainly used in electronic appliances, LED lighting, the hardware industry, the printing industry, and other manufacturing industries.
  • Flex Bonding.
  • Thermal Interface-Damping-Cushioning.
  • Electronic transistor use.
  • It can replace hot melt adhesive, screw, fastener, and other fixing methods.
  • Assembly of the heat sink and DDR-RAM module.
  • Assembly of the LED light bar module and metal frame bezel.
  • Die-cut piece and Laminate.
  • Applied to the chip, flexible circuit boards, high-power transistors, heat sinks, or other cooling device bonding.
Thermal-Conduct-Tape-Application

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