Thermal Tape

Double-sided thermal tape is made of transfer thermal conduct glue or glass fiber coated with thermal conduct glue.

• Color: White
• Thickness(mm): 0.05 | 0.1 | 0.15 | 0.2 | 0.25 | 0.3
• Width: Customized
• Die-cutting: Any shape
• Samples: Free

Usage: LED panel light, LED light bar components, and metal frame assembly.

• High Mechanical Strength.
• Improved surface wet-out for rough surface/LSE substrates.
• Excellent shock performance.
• Customized the sizes and length.
• Halogen-free.
• Ideal for thin bonding applications.
• High tacky thermal conductive PSA.
• The performance of thermal conductivity, insulation, buffer, and high tacky make it the best choice for an electronic application.
• Flexible and conformable. Ideal for uneven surfaces.
• Stable and economical with different thicknesses and constructions.

• Good thermal transfer.
• High bonding.
• Strong adhesion, replacing screw fixation.
• Perfect thickness standard.
• Excellent thermal conductivity and insulation
• Complete thickness standard is available.
• Various structures are for different applications.
• Stable and economic.
• The superior adhesion strength and thermal conductive efficiency.
• Easy for die-cutting.
• High tensile strength, easy to use.

• IC Packaging Heat Conduction‎.
• IC heat sink use.
• Between heat sink and package chip.
• Circuit board heat dissipation and protection.
• Fixing the heat sink on the power supply circuit board.
• Fixing heat sink on vehicle control circuit board.
• Replacing screws, fasteners, and other fixed means.
• Power circuit board.
• Vehicle control circuit board.
• Heatsink-Thermal Interface Attachment‎.
• Heatsink-Thermal Interface-Non Bonding.
• Battery Thermal Management‎.
• LED Lighting Thermal Management‎.

• LED light bar heat dissipation, prolongs life.
• LED light bar and metal frame.
• For CPU, LED, PPR heat sink, micro process.
• Mainly used in electronic appliances, LED lighting, hardware industry, printing industry, and other manufacturing industries.
• Flex Bonding.
• Thermal Interface-Damping-Cushioning.
• Electronic transistor use.
• It can replace hot melt adhesive, screw, fastener, and other fixing methods.
• Assembly of the heat sink and DDR-RAM module.
• Assembly of the LED light bar module and metal frame bezel.
• Die-cut piece and Laminate.
• Applied to the chip, flexible circuit boards, high-power transistors, heat sinks, or other cooling device bonding.