TESA 8410

TESA 8410 is a 60 µm amber reactive structural bonding film.

• Color: Amber
• Adhesive Type: nitrile rubber / phenolic resin
• Backing material: none
• Liner Type: glassine
• Total thickness: 60 µm
• Bonding strength: 12 N/mm²

• Reliable chip module bonding.
• Suitable for PVC, ABS, PET, and PC cards.
• Good workability on all common implanting lines.
• Outstanding aging resistance.
• Lifelong flexibility due to high rubber content.

• It is specially designed for the embedding of chip-modules into smart cards.
• It is also suitable for bonding all thermal-resistant materials such as metal, glass, plastic, wood, and textiles.